| No. | Item | Rigid PCB Process Capability | ||||
| 1 | Layer | 1 - 30 Layer | ||||
| 2 | Materials | FR-4, Aluminum, High Frequency, Halogen-Free, Heavy Copper, PTFE, BT etc. | ||||
| 3 | Maximum Finished Board Size | Single & Double - sided PCB | 600 * 1000 mm | |||
| Multi-layer | 4≤L≤6 | 600 * 900 mm | ||||
| 8≤L≤30 | 500 * 600 mm | |||||
| 4 | Tolerance of the Dimension Size | ± 0.13 mm | ||||
| 5 | Board thickness | 0.2mm≤ T ≤6.0mm | ||||
| 6 | Min. Drilling Hole Size | 0.15mm(mechanical) & 0.1mm(Laser) | ||||
| 7 | Max. Aspect Ratio | 13 : 1 | ||||
| 8 | Gold Thickness | Hard Gold | 50U" | |||
| Immersion Gold | 4U" | |||||
| 9 | Copper Weight | External layer | 210Um (6 Oz) | |||
| Internal layer | 210Um (6 Oz) | |||||
| 10 | Min. Trace Width/Space | 3/3mil | ||||
| 11 | Annual Ring | Via Hole | 3 mil | |||
| Component Hole | 6 mil | |||||
| 12 | Copper to Edge Spacing | 0.25mm | ||||
| 13 | Base Copper Min. Trace Width/Space | 0.5 Oz | 3/3 mil | |||
| 1 Oz | 4/4 mil | |||||
| 2 Oz | 5/5 mil | |||||
| 3 Oz | 7/7 mil | |||||
| 4 Oz | 8/8 mil | |||||
| 5 Oz | 9/9 mil | |||||
| 14 | Surface Treatment |
HAL / HAL Pb free / OSP / ENIG Immersion Tin / Immersion Silver Plating Gold / Plating Silver |
||||
